What happened
According to a report by Maekyung, Tesla and NVIDIA have paid Samsung roughly $3 billion combined to develop substrates for artificial intelligence chips. Tesla's portion is reported at $830 million, in exchange for a five-year supply guarantee.
Why substrates matter
The technology is called Flip Chip-Ball Grid Array (FC-BGA). In simple terms, the die is flipped upside down and connected to the substrate in the package through solder bumps. This delivers significantly better performance than older approaches such as Plastic Ball Grid Array (PBGA).
The two companies reportedly moved early because substrates are expected to become the next bottleneck in the AI supply chain. FC-BGA is a critical component in advanced packaging such as chip-on-wafer-on-substrate (CoWoS).



