What's happening?
NVIDIA has widened the manufacturing partners for NVHBM, its custom high-bandwidth memory solution. Samsung and TSMC are working together on base die production, which is being done on the 3nm node.
Who is involved?
The process includes not only the two foundry giants but also memory makers Micron and SK hynix. The NVHBM supply chain is thus taking a multi-partner shape on both the foundry and memory sides.
Why it matters
HBM is among the components that determine performance in AI accelerators. The base die is the foundation layer on which memory stacks are built; producing it on an advanced node like 3nm aims to make the data path between memory and processor more efficient.
Supply chain impact
Bringing multiple foundry and memory partners into the same product can be read as a move to reduce dependence on a single supplier and increase production capacity. The company has not shared an official launch timeline.
