Qualcomm to license patents behind Huawei's LogicFolding chip architecture
According to Bloomberg, Qualcomm has reached a deal to license the patents behind Huawei's LogicFolding chip-stacking technology. The method, used in the Kirin 9050 Pro, splits nearly every block across two bonded dies. The multi-year cross-license covers 5G devices, AI services and optical networks, and remains subject to approval.
