What is LogicFolding?
With no access to advanced EUV lithography tools, Huawei is leaning on packaging technologies instead of the traditional path. Its LogicFolding architecture, unveiled in May, sits at the center of that strategy.
Early results on target
According to Wccftech, LogicFolding has performed above expectations. Early test results for a Kirin chipset expected in 2027 show Huawei hitting its own targets. The key point: these results were achieved without depending on advanced manufacturing nodes.
Why it matters
Export restrictions keep Huawei away from the newest manufacturing processes. Packaging-centric approaches like LogicFolding are an attempt to compensate on the architecture and packaging side. The company has also said it shipped 100 million Kirin chipsets since 2023.
Open questions
The shared information is based on early test results; final product performance, efficiency and production scale remain unclear.
